Rexroth 0360-400-00MF01 Semiconductor Gas Flow / Pneumatic Module

Product Brief Introduction AMAT 0360-400-00MF01 is a precision gas or pneumatic control module for Applied Materials semiconductor wafer process equipment. It is installed in gas panel subsystem, used for process gas distribution, flow regulation and on-off control for wafer plasma processing.
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Technical Specifications Working Medium: Inert gas and semiconductor process gas Operating Pressure: Vacuum to medium pressure Operating Temperature: 10℃ ~ 60℃ Mounting: Panel rack mounting Material Cleanliness: Semiconductor clean grade

Functional Features Precise on-off and flow regulation of process gas. Internal gas path with low particle and low outgassing design. Resist corrosive semiconductor process gas. Integrated filter or sealing structure. Modular structure for fast replacement. Internal leakage protection for gas path.

Application Scenarios Applied Materials semiconductor equipment gas supply panel. Plasma etch and thin film deposition gas delivery subsystem. Process gas flow control for wafer fabrication. Fab preventive maintenance spare gas module. Centura platform gas manifold control unit.

Performance Parameters Leak rate: Ultra low internal and external gas leakage Particle performance: Low particle release during gas switching Flow repeatability: Stable gas flow control accuracy Chemical compatibility: Adapt to halogen and inert process gas

Material Composition Main body: High purity stainless steel alloy Sealing components: High purity fluoropolymer Connecting fittings: Electropolished stainless steel

Structural Characteristics Compact integrated gas module assembly. Electropolished internal gas flow channel. Standard gas port interface for pipeline connection. Built-in sealing structure for gas path isolation. Rack mounting bracket for panel installation.

Working Principle This module controls on-off and flow of process gas from upstream gas pipeline. It delivers gas with stable flow rate to process chamber, prevents gas leakage and reduces particle contamination inside gas path for wafer etching or deposition.

Installation Requirements Complete particle inspection inside cleanroom before installation. Check gas port sealing surface for scratch and contamination. Connect gas pipeline strictly following gas schematic. Tighten fitting according to specified torque. Perform helium leak test and gas purge after installation.




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