Technical Specifications Operating Environment: High vacuum, halogen plasma corrosive atmosphere Operating Temperature: 10℃ ~ 220℃ Mounting: Bolt fixed installation Surface Treatment: Precision machining and surface passivation Cleanliness Standard: Semiconductor cleanroom grade
Functional Features Precision positioning and mechanical support for internal chamber parts. Low particle and low outgassing material characteristics. Resist plasma and corrosive process gas erosion. Stable dimensional performance under repeated thermal cycling. Auxiliary vacuum sealing for chamber assembly. Modular structure for fast on-site maintenance replacement.
Application Scenarios Applied Materials PVD, CVD and plasma etch vacuum chamber. Semiconductor wafer fabrication plasma processing subsystem. Chamber internal support and positioning mechanical structure. Fab preventive maintenance spare parts for Centura and Endura platforms. Wafer thin film deposition and etching production equipment.
Performance Parameters Helium leak rate: Meet high vacuum chamber leak specification Particle emission: Minimal particle generation during thermal cycle Thermal deformation: Low dimensional variation under temperature change Chemical resistance: Stable under halogen plasma environment
Material Composition Base material: High purity aluminum alloy Surface treatment: Hard anodized anti-corrosion coating Auxiliary parts: High purity fluoropolymer sealing elements
Structural Characteristics Monolithic precision machined solid component. Built-in positioning pin holes and threaded mounting holes. Seal groove for vacuum sealing assembly. Stress relieved structure to reduce thermal distortion. Compact outline adapting to limited internal chamber space.
Working Principle This component serves as supporting and positioning part inside the vacuum chamber. It keeps precise relative position of adjacent chamber assemblies under thermal and mechanical load, maintains vacuum sealing integrity and reduces particle contamination during wafer processing.
Installation Requirements Complete particle inspection and cleaning inside ISO cleanroom before installation. Check precision surface for scratch, crack and contamination. Align positioning features accurately during assembly. Tighten mounting bolts following factory specified torque sequence. Carry out helium leak test after installation.
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