AMAT 0190-30354 Semiconductor Vacuum Chamber Assembly

Product Brief Introduction AMAT 0190-30354 is a precision mechanical assembly for Applied Materials wafer processing equipment. It is installed inside the vacuum reaction chamber, responsible for supporting internal process components and maintaining vacuum boundary for plasma etching or deposition.
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Technical Specifications Operating Condition: High vacuum, corrosive plasma environment Operating Temperature: 5℃ ~ 200℃ Mounting: Bolt fastening assembly Surface Finish: Ultra-precision machining Cleanliness: Fab cleanroom requirement

Functional Features Mechanical support and alignment of chamber internal components. Low particle and low outgassing performance. Anti-corrosion against halogen plasma and process gas. Stable dimension under repeated heating and cooling cycles. Vacuum sealing matching interface design. Easy disassembly for preventive maintenance.

Application Scenarios Applied Materials plasma etch and thin film deposition chamber. Semiconductor wafer manufacturing vacuum subsystem. Chamber internal fixture and supporting assembly. Preventive maintenance spare for Centura platform process tools. High vacuum plasma processing equipment.

Performance Parameters Vacuum tightness: Ultra low helium leak rate Surface roughness: Ultra-smooth precision machined surface Thermal stability: Small thermal expansion coefficient Contamination control: Low outgassing under vacuum condition

Material Composition Base material: High purity aluminum alloy Surface treatment: Hard anodized coating Sealing accessories: High purity fluoropolymer seals

Structural Characteristics Integrated pre-machined mechanical assembly. Positioning holes and threaded mounting interfaces. Seal groove for vacuum seal installation. Stress relieved body to minimize thermal deformation. Standard mounting hole layout matching original chamber design.

Working Principle This assembly forms part of vacuum chamber internal mechanical framework. It bears thermal and mechanical load during wafer process, ensures alignment of surrounding process parts and maintains vacuum tightness to keep stable plasma reaction environment.

Installation Requirements Perform cleaning and particle inspection in cleanroom before assembly. Check surface scratch, corrosion and seal integrity. Align positioning features with equipment base accurately. Tighten fasteners to factory torque specification. Run vacuum pumping and helium leak test after installation.




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