Technical Specifications Operating Condition: High vacuum and corrosive plasma environment Operating Temperature: 10℃ ~ 210℃ Mounting: Bolt fixed installation Surface Finish: Precision machining and passivation Cleanliness Grade: Semiconductor cleanroom standard
Functional Features Precision mechanical support and positioning of chamber internal assemblies. Low particle and low outgassing performance. Resist erosion from halogen plasma and process gas. Stable dimensional performance under thermal cycling. Auxiliary vacuum sealing function. Easy disassembly and replacement for fab maintenance.
Application Scenarios Applied Materials plasma etch and thin film deposition chamber. Semiconductor wafer manufacturing vacuum processing subsystem. Chamber internal mechanical supporting and positioning structure. Preventive maintenance spare parts for Centura platform process tools. High vacuum plasma wafer processing equipment.
Performance Parameters Helium leak rate: Meet high vacuum chamber leak requirement Particle emission: Low particle release during thermal cycle Thermal deformation: Small dimensional variation under temperature change Chemical resistance: Stable under halogen plasma environment
Material Composition Base material: High purity aluminum alloy Surface treatment: Hard anodized coating Sealing accessories: High purity fluoropolymer seals
Structural Characteristics Monolithic precision machined solid component. Positioning holes and threaded mounting interfaces. Seal groove for vacuum seal assembly. Stress relieved body to minimize thermal deformation. Compact structure adapting to limited chamber space.
Working Principle This component provides mechanical support and positioning inside vacuum chamber. It maintains stable relative position of adjacent process components under thermal load, protects vacuum sealing integrity and controls particle contamination for wafer manufacturing.
Installation Requirements Carry out particle inspection and cleaning in cleanroom before installation. Check machined surface for scratch, crack and contamination. Align positioning features accurately. Tighten fasteners according to factory torque specification. Perform helium leak test after assembly.
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