AMAT 0190-26873 Semiconductor Chamber Mechanical Assembly

Product Brief Introduction AMAT 0190-26873 is a pre-machined mechanical assembly for Applied Materials semiconductor wafer vacuum process chamber. It serves as supporting and positioning structure inside plasma reaction chamber, bearing thermal and mechanical load during wafer etching or thin film deposition process.
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Technical Specifications Operating Condition: High vacuum, corrosive plasma environment Operating Temperature: 10℃ ~ 220℃ Mounting: Bolt fastening assembly Surface Treatment: Precision polishing Cleanliness Level: Semiconductor fab cleanroom requirement

Functional Features Provide mechanical support and positioning for chamber internal parts. Maintain vacuum boundary integrity of process chamber. Resist chemical erosion caused by halogen plasma. Low particle emission and low outgassing characteristic. Stable geometric dimension under thermal cycling. Modular assembly for convenient field replacement.

Application Scenarios Applied Materials PVD and CVD thin film deposition chamber. Wafer plasma etching equipment internal mechanical assembly. High vacuum process chamber supporting structure. Semiconductor fab preventive maintenance spare assembly. Advanced wafer manufacturing plasma processing equipment.

Performance Parameters Leakage rate: Meet ultra low vacuum leak specification Dimensional stability: Low thermal expansion coefficient Surface roughness: Ultra-smooth precision machined surface Contamination control: Non-outgassing material property

Material Composition Base material: High purity aluminum alloy or stainless steel Surface treatment: Anti-corrosion passivation or anodized coating Auxiliary sealing: High purity fluorine sealing material

Structural Characteristics Integrated precision machined assembly. Built-in positioning features for accurate chamber assembly. Groove structure for vacuum seal installation. Stress relieved structure to reduce thermal deformation. Standardized mounting hole layout matching original chamber design.

Working Principle This assembly forms part of vacuum chamber internal mechanical structure. It supports adjacent process components and maintains geometric alignment during equipment operation. The sealing interface prevents gas penetration between vacuum chamber and outside atmosphere, ensuring stable pressure and clean plasma environment for wafer processing.

Installation Requirements Complete surface cleaning in cleanroom before assembly. Check surface scratch, corrosion and particle contamination before installation. Assemble according to torque specification of original equipment manual. Carry out vacuum leak detection after installation. Verify alignment with surrounding chamber components.




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