Technical Specifications Operating Condition: High vacuum and corrosive plasma Operating Temperature: 10℃ ~ 200℃ Mounting: Bolt fixed installation Surface Treatment: Precision machining Cleanliness Standard: Cleanroom grade for semiconductor manufacturing
Functional Features Mechanical support and positioning for chamber internal assemblies. Low particle emission and low outgassing property. Resist chemical erosion caused by halogen plasma. Stable dimension under repeated thermal cycles. Auxiliary vacuum sealing structure. Convenient disassembly for on-site replacement.
Application Scenarios Applied Materials plasma etch and thin film deposition chamber. Semiconductor wafer fabrication vacuum processing equipment. Chamber internal mechanical supporting subsystem. Preventive maintenance spare parts for Centura platform. Plasma reaction chamber mechanical components.
Performance Parameters Helium leak rate: Comply with high vacuum specification Particle performance: Minimal particle release during thermal cycling Thermal property: Low thermal expansion coefficient Corrosion resistance: Stable in halogen plasma environment
Material Composition Base material: High purity aluminum alloy Surface treatment: Hard anodized coating Sealing accessories: High purity fluoropolymer seals
Structural Characteristics Integrated precision machined solid component. Positioning holes and threaded mounting holes. Seal groove for vacuum seal installation. Stress relieved structure for anti-deformation. Compact outline to adapt narrow chamber internal space.
Working Principle This component supports and locates internal chamber parts. It maintains stable mechanical alignment under temperature variation, ensures vacuum boundary integrity and reduces particle contamination in wafer processing environment.
Installation Requirements Carry out surface cleaning and particle inspection in cleanroom. Check surface scratch, corrosion and seal damage before assembly. Align positioning features accurately. Tighten mounting bolts to factory torque requirement. Execute vacuum leak detection after installation.
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