Technical Specifications Operating Environment: High vacuum and plasma corrosive atmosphere Operating Temperature: 10℃ ~ 200℃ Mounting: Bolt fixed assembly Surface Finish: Precision machining and polishing Cleanliness: Semiconductor cleanroom grade
Functional Features Precision mechanical support and positioning inside vacuum chamber. Resist plasma and halogen gas chemical erosion. Low particle and low outgassing material property. Stable dimension under repeated thermal cycles. Vacuum sealing auxiliary function for chamber assembly. Easy disassembly for field maintenance replacement.
Application Scenarios Applied Materials PVD, CVD and plasma etch chamber internal assembly. Wafer transfer mechanism supporting structure. Vacuum chamber sealing and positioning assembly. Semiconductor fab equipment preventive maintenance spare part. Plasma processing equipment vacuum module.
Performance Parameters Vacuum leak performance: Meet high vacuum chamber leak requirement Particle emission: Low particle generation during equipment operation Thermal stability: Minimal deformation under temperature cycling Chemical resistance: Resist corrosion from plasma and process gas
Material Composition Base material: High purity aluminum alloy or stainless steel Surface treatment: Passivation or hard anodized coating Auxiliary sealing parts: High purity fluoropolymer
Structural Characteristics Monolithic precision machined solid component. Built-in positioning holes and threaded mounting holes. Seal groove structure for vacuum sealing installation. Stress relieved structure to reduce thermal deformation. Compact outline adapting to limited chamber internal space.
Working Principle This component provides mechanical positioning and supporting function inside vacuum chamber. It maintains relative position of adjacent process components under thermal load, keeps vacuum sealing integrity and reduces particle contamination in wafer processing environment.
Installation Requirements Complete cleaning and particle inspection inside cleanroom. Check surface scratch, crack and seal integrity before assembly. Align positioning features with equipment base accurately. Tighten mounting bolts to factory specified torque. Execute helium leak test after installation.
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