Technical Specifications Operating Condition: High vacuum with corrosive process gas and plasma Operating Temperature: 5℃ ~ 200℃ Installation Type: Bolt fixed assembly Surface Treatment: Precision polishing Material Standard: Semiconductor clean grade alloy
Functional Features Mechanical support and positioning for chamber internal parts. Vacuum sealing and gas path isolation capability. Low particle and low outgassing performance. Resist erosion caused by plasma and halogen process gas. Stable dimension under repeated thermal cycling. Easy disassembly for field maintenance and replacement.
Application Scenarios Applied Materials PVD, CVD and etch chamber internal assembly. Vacuum gas pipeline and manifold connection structure. Wafer transfer and positioning mechanical subsystem. Semiconductor fab equipment preventive maintenance spare parts. Plasma processing equipment vacuum module assembly.
Performance Parameters Vacuum leakage rate: Ultra low leak specification Outgassing performance: Low gas release under vacuum Dimensional stability: Low thermal expansion coefficient Particle emission: Minimal contaminant release during operation
Material Composition Base material: High purity stainless steel or aluminum alloy Surface treatment: Passivation or hard anodized coating Auxiliary sealing parts: High purity fluoropolymer seal
Structural Characteristics Monolithic precision machined solid component. Positioning holes and threaded mounting interfaces. Seal groove for vacuum seal installation. Stress relieved body to reduce thermal deformation. Compact outline adapting to limited chamber internal space.
Working Principle This component forms part of vacuum chamber boundary or gas manifold assembly. It maintains mechanical alignment of adjacent parts and vacuum tightness, prevents external contamination and gas leakage, keeps stable plasma process environment for wafer treatment.
Installation Requirements Complete cleaning and particle inspection inside cleanroom. Check surface scratch, corrosion and seal integrity before assembly. Align positioning features with equipment base accurately. Tighten mounting bolts to specified torque. Execute helium leak test after installation.
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