Technical Specifications Operating Environment: High vacuum clean environment Operating Temperature: 15℃ ~ 180℃ Mounting: Bolt fixed assembly Material Grade: Semiconductor low particle alloy Cleanliness Standard: Fab cleanroom requirement
Functional Features Precise mechanical positioning and wafer clamping. Low particle generation during mechanical movement. Vacuum compatible material characteristic. Minimal thermal deformation under temperature cycling. Modular design for convenient disassembly and maintenance. Interface fully compatible with original equipment mechanical structure.
Application Scenarios Applied Materials wafer transfer end effector assembly. Process chamber wafer positioning mechanical structure. PVD, CVD and etch equipment wafer handling subsystem. Semiconductor fab preventive maintenance spare assembly. Centura and Endura platform wafer transfer module.
Performance Parameters Positioning repeatability: High precision positioning accuracy Particle generation: Meet wafer manufacturing contamination control requirement Thermal stability: Small dimensional variation under temperature change Vacuum adaptability: Suitable for high vacuum operating condition
Material Composition Main structure body: High purity aluminum alloy or stainless steel Surface coating: Low particle anti-adhesion coating Moving contact parts: Wear resistant non-contamination material
Structural Characteristics Pre-assembled integrated mechanical assembly. Precision machined wafer contact surface. Built-in positioning pin and guide structure. Mounting holes matched with original equipment base. Stress relieved structure to reduce thermal distortion.
Working Principle The assembly completes clamping, supporting or transferring wafer under vacuum environment. It keeps high repeatability of wafer position during movement, reduces particle generation from friction and maintains stable geometric dimension under chamber thermal cycle.
Installation Requirements Complete cleaning and particle inspection inside cleanroom. Check contact surface for scratch, crack and particle contamination. Align mounting interface with equipment base accurately. Tighten fasteners to factory specified torque value. Run dry cycle test to verify movement after installation.
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