Honeywell 2MLR-CPUHT ControlNet Redundant CPU Host Interface Module

Network interface: ControlNet 5Mbps, dual channel. CPU interface: Honeywell proprietary parallel bus. Redundancy mode: hot standby, bumpless switchover. Power supply: 5V DC from backplane. Power dissipation: 3W. Operating temperature range: 0°C to +60°C. Storage temperature range: -40°C to +85°C. Slot width: 1 single slot.

It supports full 2-out-of-2 redundancy for controller communications. Bumpless switchover occurs with no process interruption or data loss. Built-in diagnostics detect faults and trigger automatic switchover. Front panel status indicators show primary/secondary state and network health. It synchronizes program and I/O data between redundant controllers.

It is used in high-availability DCS systems, critical process control, power generation control, safety instrumented systems, and continuous manufacturing processes requiring maximum controller uptime.

Switchover time: <50ms bumpless. Data synchronization latency: <1ms. ControlNet data rate: 5Mbps. Operating temperature range: 0°C to +60°C. Vibration resistance: 2G @ 10Hz to 500Hz. Shock resistance: 30G.

Front panel: flame-retardant engineering plastic. PCB: FR-4 substrate with conformal coating. Connectors: gold-plated copper alloy. Shielding: tin-plated steel.

It features standard control system card form factor, front panel status LEDs (PRI, SEC, OK), rear backplane connector, and card guide rails for chassis mounting.

It establishes dual ControlNet connections and continuously synchronizes program, I/O and status data between primary and secondary controllers. When a primary controller fault is detected, it initiates bumpless transfer of control to the secondary controller, maintaining uninterrupted process operation and network communication.

Install one module in each of the primary and secondary controller chassis slots. Ensure both modules run identical firmware revisions. Connect both ControlNet channels for redundant media operation. Configure redundancy parameters via system engineering software. Verify proper chassis grounding.