B&R 3DM476 X20 Digital Mixed I/O Module

Product Brief Introduction The 3DM476 is a 16-channel digital mixed input/output module for the B&R X20 system. It combines 8 digital inputs and 8 digital outputs in a single module, providing flexible discrete signal handling for machine control applications.
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Technical Specifications

Inputs: 8 channels, 24V DC sourcing. Outputs: 8 channels, 24V DC sourcing, 0.5A per channel. Input delay: 0.2ms. Output switching time: <0.1ms. Isolation: 500V AC channel-to-bus. Power dissipation: 1.5W. Operating temperature range: -25°C to +60°C.

Functional Features

Combined input and output reduces module count and cabinet space. Per-channel status indicators. Input filtering eliminates contact bounce. Output short-circuit protection. Hot-swap capability. Spring-cage terminals for quick wiring.

Application Scenarios

It provides discrete I/O for machine control, conveyor systems, packaging equipment, material handling and general industrial automation applications.

Performance Parameters

Input response: 0.2ms. Output switching: <0.1ms. Output current: 0.5A per channel. Isolation: 500V AC. Operating temperature range: -25°C to +60°C. Vibration resistance: 2G @ 10Hz to 500Hz.

Material Composition

Housing: UL 94 V-0 plastic. PCB: FR-4. Outputs: MOSFET semiconductors. Terminals: spring-cage copper alloy.

Structural Characteristics

It features compact X20 module form factor, front panel channel status LEDs, spring-cage terminal strip, side bus connector, and DIN rail mounting base.

Working Principle

It receives discrete input signals from field devices, conditions and filters them, and passes them to the CPU via the X20 bus. It receives output commands from the CPU and drives solid-state output circuits to switch power to field loads.

Installation Requirements

Mount on X20 DIN rail base. Connect to adjacent modules via side bus. Wire field devices to spring-cage terminals. Group common connections. Verify 24V DC supply.

Usage Notes

Do not exceed output current ratings. Use surge suppression for inductive loads. Check status LEDs for fault diagnosis. Modules are hot-swappable but follow ESD procedures.




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