Technical Specifications
Input voltage: 24V DC ±10%. I/O channels: 24 digital input, 16 digital output, 4 analog input. Communication: TEL SEMI equipment bus. Operating temperature range: 15°C to +35°C. Storage temperature range: -10°C to +60°C. Protection rating: IP20.
Functional Features
Signal conditioning and level matching for process chamber sensors and actuators. Built-in diagnostics support fault detection and chamber troubleshooting. Conforms to SEMI equipment communication standards. Modular design enables quick replacement during preventive maintenance. Per-channel status indicators for real-time status visibility.
Application Scenarios
It is used in TEL wafer etching systems, CVD deposition equipment, photolithography track systems, semiconductor process chambers, and 300mm wafer fabrication tools.
Performance Parameters
Digital I/O response time: <1ms. Analog resolution: 12-bit. Communication throughput: 10Mbps. Operating temperature range: 15°C to +35°C. Vibration resistance: 1G @ 10Hz to 500Hz.
Material Composition
Housing: ESD-safe flame-retardant plastic. PCB: FR-4 with semiconductor-grade components. Connectors: gold-plated for high reliability. Shielding: tin-plated steel.
Structural Characteristics
It features compact rack-mount card design, front panel status LEDs, SEMI standard multi-pin connectors, rear backplane interface, and card guide rails for equipment chassis installation.
Working Principle
It receives sensor signals from process chamber subsystems, conditions and level-converts the signals, and transmits the data to the main equipment controller via the equipment bus. It also converts controller output commands into appropriate signal levels to drive chamber actuators and process control elements.
Installation Requirements
Install in designated equipment chassis slot. Ensure firm backplane connection. Use specified TEL compatible cables for field connections. Observe ESD procedures during all handling. Ensure reliable equipment grounding.
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