TEL 1381-648241-12 Vacuum Pressure Monitoring Board

Product Brief IntroductionThis monitoring board is used for TEL semiconductor processing equipment. It collects analog pressure sensor signals inside vacuum chamber and converts analog signals into digital data for host control system.
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Technical Specifications

Power supply: 24V DC

Operating temperature: 15°C to 35°C

Input signal: 4-20mA analog signal

Number of analog channels: 8 channels

Functional Features

Multi-channel analog signal acquisition and conversion. Pressure value real-time calculation and transmission. Over-range alarm function. Signal anti-interference processing for vacuum environment.

Application Scenarios

Vacuum chamber pressure monitoring module of TEL etcher, thin film deposition semiconductor equipment.

Performance Parameters

Conversion precision: ±0.1% full scale

Sampling frequency: 5kHz

Input impedance: 250Ω

Insulation resistance: ≥1000MΩ

Structural Characteristics

Coated multi-layer PCB. Gold-plated edge connector for backplane plug-in. Front panel with status indicator lights. Standard card structure matching TEL chassis.

Material Composition

PCB: FR-4 flame retardant board. Connector: gold-plated copper alloy. Signal conditioning components: metal film resistor and precision operational amplifier chip.

Working Principle

It receives 4-20mA pressure analog signals from vacuum sensors, converts analog signals to digital values, transmits pressure data to main controller through internal bus, and triggers alarm when pressure exceeds preset threshold.

Installation Requirements

Insert into matched equipment backplane slot and lock front panel. Confirm the definition of analog wiring terminals. Complete wiring before power on. Keep cabinet sealed to reduce dust.

Usage Notes

Power off before disassembly. Calibrate pressure channel periodically. Avoid electrostatic discharge damage to circuit. Do not operate in environment with corrosive vapor.




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