Product Brief Introduction
This control board is a core spare part for TEL semiconductor etching equipment. It realizes signal collection and logic control of gas path, pressure sensor and mechanical actuator inside process chamber.
Technical Specifications
Supply voltage: 24V DC
Operating temperature: 15°C to 35°C
Storage temperature: -20°C ~ 65°C
Digital I/O channels: 16 input and 16 output
Communication interface: serial bus
Functional Features
High-speed acquisition of chamber sensor signals. Output logic control signal for valve and actuator. Built-in signal filtering and noise suppression. Circuit self-diagnosis and fault reporting function.
Application Scenarios
TEL plasma etching machine, semiconductor process chamber control unit, vacuum gas control subsystem in wafer fabrication plant.
Performance Parameters
Signal sampling rate: 10kHz
Output driving capacity: 0.1A per channel
Insulation withstand voltage: 1500V AC
MTBF: ≥45000 hours
Structural Characteristics
Rigid printed circuit board with coated protection. Edge card connector for backplane connection. Onboard status LED indicators. Standard mounting hole layout.
Material Composition
PCB substrate: FR-4 glass fiber board. Connector: gold-plated copper alloy. Passive components: ceramic and metal film materials.
Working Principle
The board communicates with the main controller through backplane bus. It receives process control commands, drives valves and actuators, collects chamber pressure and sensor signals, and feeds real-time process status back to host system.
Installation Requirements
Insert the board into designated slot of equipment backplane. Lock the board front panel. Check backplane contact before power on. Maintain clean environment to avoid particle contamination.
Usage Notes
Do not touch gold-plated edge connector by bare hands. Power off the whole system before board replacement. Prevent corrosive gas erosion. Stop operation immediately if fault indicator lights up.
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