Technical Specifications Power Supply: 15V / 24V DC Operating Temperature: 10℃ ~ 60℃ Mounting: Flange or manifold threaded mounting Gas Compatibility: Inert gas and corrosive halogen process gas
Functional Features Real-time high-precision vacuum pressure detection. Pressure signal conversion to standard analog or digital signal output. Low particle generation and low outgassing wetted surface design. Resist erosion from semiconductor corrosive process gas. Maintain measurement stability under repeated thermal cycles. On-board circuit for signal amplification and conditioning.
Application Scenarios Semiconductor plasma etching and thin film deposition vacuum chamber. Process gas supply manifold vacuum pressure monitoring. Wafer fabrication equipment vacuum measurement spare parts. Fab preventive maintenance for MKS vacuum gauge replacement. High-vacuum plasma processing equipment pressure control subsystem.
Performance Parameters Measurement precision: Reliable vacuum pressure sampling Signal stability: Minimal zero drift with temperature variation Leak performance: Comply with high vacuum helium leak requirement Chemical resistance: Tolerate halogen containing process gas
Material Composition Wetted parts: Electropolished high purity stainless steel or nickel alloy Seals: High purity fluoropolymer Internal electronic assembly: Industrial signal processing PCB
Structural Characteristics Compact integrated pressure gauge assembly. Ultra-smooth electropolished internal wetted surface. Built-in pressure sensing chip. Dedicated electrical connector for power and signal. Protective sealed housing for electronic components.
Working Principle The pressure sensing chip captures pressure changes in vacuum pipeline or chamber and generates corresponding electrical signal. Internal circuit processes and converts raw signal into standard output, sending data to host controller to realize pressure monitoring and process interlock.
Installation Requirements Carry out particle inspection and cleaning inside cleanroom before installation. Check sealing surface for scratches and foreign contaminants. Install and fix according to installation orientation requirement. Tighten mounting fasteners following specified torque. Perform helium leak detection after assembly.
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