MKS 07-7331-230H1010 Semiconductor Mass Flow Controller Module

Product Brief Introduction MKS 07-7331-230H1010 is a thermal mass flow controller for semiconductor wafer processing equipment. It accurately regulates mass flow of process gas supplied to vacuum chamber for plasma etching and thin film deposition processes.
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Technical Specifications Working Medium: Inert gas and corrosive semiconductor process gas Operating Pressure: Vacuum to medium inlet pressure Operating Temperature: 10℃ ~ 60℃ Mounting: Gas manifold panel mounting Wetted material: High purity electropolished metal and fluoropolymer seal

Functional Features High precision mass flow measurement and control. Low particle and low outgassing internal gas path. Good corrosion resistance to halogen containing process gas. Stable flow repeatability under continuous operation. Integrated shut-off valve for gas isolation. Modular design for easy replacement on gas panel.

Application Scenarios Semiconductor fab gas delivery subsystem. Plasma etch, CVD and PVD process gas supply. MKS mass flow control spare parts for wafer process equipment. Vacuum chamber gas feed control unit. Preventive maintenance spare module for semiconductor process tools.

Material Composition Body: Electropolished high purity stainless steel Sealing elements: High purity fluoropolymer Sensing unit: Thermal mass flow sensor

Structural Characteristics Compact integrated MFC assembly. Electropolished smooth internal gas channel. Standard gas inlet and outlet ports. Integrated shut-off valve structure. Electrical connector for power and communication signal.

Working Principle Thermal sensor measures gas mass flow in real time. The control circuit compares feedback flow value with setpoint, adjusts control valve opening continuously to stabilize gas mass flow, ensuring consistent gas supply into process vacuum chamber.

Installation Requirements Inspect and clean module in cleanroom before assembly. Check port sealing surface for scratch, dent and contamination. Install following the marked gas flow direction. Tighten gas fittings according to torque specification. Perform helium leak test and gas purging after installation.

Usage Notes Use cleanroom gloves during handling. Protect gas sealing surface from scratch and impact. Avoid particle entering gas flow path. Store spare unit inside sealed clean packaging. Prohibit contact with grease and organic contaminants.




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