Technical Specifications Working Medium: Inert gas and semiconductor corrosive process gas Operating Pressure: Vacuum to medium inlet pressure Operating Temperature: 10℃ ~ 60℃ Mounting: Gas panel manifold mounting Gas wetted material: Corrosion resistant alloy and fluoropolymer
Functional Features Precise mass flow regulation of semiconductor process gas. Low particle and low outgassing gas path design. Resist erosion from halogen and corrosive process gas. High repeatability and stable flow control. Built-in shut-off valve for gas on/off control. Modular structure for quick replacement and maintenance.
Application Scenarios Semiconductor wafer fabrication gas supply panel. Plasma etch and thin film deposition process gas delivery system. MFC mass flow control subsystem for wafer process tools. Fab preventive maintenance spare gas flow module. Vacuum plasma processing equipment gas manifold.
Performance Parameters Flow control accuracy: High precision mass flow regulation Leak performance: Ultra low internal and external leak rate Response speed: Fast flow setpoint adjustment Chemical compatibility: Compatible with common semiconductor process gases
Material Composition Main body: Electropolished high purity stainless steel Sealing parts: High purity fluoropolymer Sensor component: MKS proprietary thermal mass flow sensor
Structural Characteristics Compact integrated MFC assembly. Electropolished internal gas flow channel. Standard gas inlet and outlet port interface. Built-in solenoid shut-off valve. Electrical connector for communication and power supply.
Working Principle The thermal mass flow sensor detects real-time gas mass flow rate. The internal control circuit compares measured flow value with setpoint, adjusts control valve opening dynamically to maintain stable gas mass flow delivered to process vacuum chamber.
Installation Requirements Complete particle inspection and cleaning in cleanroom before installation. Check gas port sealing surface for scratch and contamination. Install module according to gas flow direction marking. Tighten fittings to specified torque. Carry out helium leak test and gas purge after installation.
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