Technical Specifications:
Part Number: 853-001983-011
Manufacturer: Lam Research
Application: Semiconductor Wafer Fabrication Equipment
Compatibility: Specific Lam Research Etch or Deposition Systems (Model Dependent)
Material: High-purity semiconductor-grade materials (e.g., Quartz, Ceramic, or Specialty Alloys)
Cleanliness Class: ISO Class 1-3 Compatible
Surface Finish: Ultra-smooth, particle-free
Operating Environment: High Vacuum / Plasma Chamber
Regulatory Compliance: RoHS, REACH
Part Number: 853-001983-011
Manufacturer: Lam Research
Application: Semiconductor Wafer Fabrication Equipment
Compatibility: Specific Lam Research Etch or Deposition Systems (Model Dependent)
Material: High-purity semiconductor-grade materials (e.g., Quartz, Ceramic, or Specialty Alloys)
Cleanliness Class: ISO Class 1-3 Compatible
Surface Finish: Ultra-smooth, particle-free
Operating Environment: High Vacuum / Plasma Chamber
Regulatory Compliance: RoHS, REACH
Functional Features:
Precision-engineered for specific process chamber requirements.
High resistance to plasma erosion and chemical corrosion.
Maintains critical dimensional tolerances for process uniformity.
Designed for minimal particle generation during operation.
Ensures optimal thermal and electrical performance within the system.
Facilitates consistent wafer processing yields.
Precision-engineered for specific process chamber requirements.
High resistance to plasma erosion and chemical corrosion.
Maintains critical dimensional tolerances for process uniformity.
Designed for minimal particle generation during operation.
Ensures optimal thermal and electrical performance within the system.
Facilitates consistent wafer processing yields.
Application Scenarios:
Logic and Memory Chip Manufacturing (DRAM, 3D NAND).
Advanced Etch Processes (Conductor, Dielectric, Metal).
Thin Film Deposition Systems (CVD, ALD, PECVD).
Semiconductor Fab Maintenance and Repair Operations.
Process Chamber Retrofitting and Upgrades.
Logic and Memory Chip Manufacturing (DRAM, 3D NAND).
Advanced Etch Processes (Conductor, Dielectric, Metal).
Thin Film Deposition Systems (CVD, ALD, PECVD).
Semiconductor Fab Maintenance and Repair Operations.
Process Chamber Retrofitting and Upgrades.
Structural Characteristics:
Complex geometry tailored to chamber internal architecture.
High-purity material composition to prevent contamination.
Precision-machined surfaces and sealing interfaces.
Integrated mounting features for secure installation.
Specialized coatings for enhanced durability against harsh process chemistries.
Complex geometry tailored to chamber internal architecture.
High-purity material composition to prevent contamination.
Precision-machined surfaces and sealing interfaces.
Integrated mounting features for secure installation.
Specialized coatings for enhanced durability against harsh process chemistries.
Working Principle:
Functions as an integral part of the process module, interacting with plasma, gases, or RF energy. It may serve as a focus ring, showerhead component, liner, or insulator, directly influencing the physical or chemical reactions on the wafer surface. Its precise placement and condition are vital for maintaining the electromagnetic field distribution and gas dynamics required for nanometer-scale patterning.
Functions as an integral part of the process module, interacting with plasma, gases, or RF energy. It may serve as a focus ring, showerhead component, liner, or insulator, directly influencing the physical or chemical reactions on the wafer surface. Its precise placement and condition are vital for maintaining the electromagnetic field distribution and gas dynamics required for nanometer-scale patterning.
Installation Requirements:
Must be installed by certified Lam Research field service engineers or qualified technicians.
Requires strict adherence to Cleanroom protocols (Class 10/ISO 4 or better).
Use of proper ESD (Electrostatic Discharge) protection gear is mandatory.
Must be installed by certified Lam Research field service engineers or qualified technicians.
Requires strict adherence to Cleanroom protocols (Class 10/ISO 4 or better).
Use of proper ESD (Electrostatic Discharge) protection gear is mandatory.
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