Technical Specifications
Frequency range: 13.56MHz. Control outputs: 2 stepper motor drives. Inputs: forward/reflected power sensors. Matching speed: <1 second. Communication: system backplane. Power dissipation: 10W. Operating temperature: 15°C to +35°C.
Functional Features
Automatic impedance matching. Forward and reflected power monitoring. Stepper motor control outputs. Tuning algorithms for fast matching. Status and fault outputs.
Application Scenarios
It controls RF matching networks for plasma etch, deposition and sputtering systems in Lam semiconductor manufacturing equipment.
Performance Parameters
Matching time: <1 second. VSWR: <1.1:1 matched. Frequency: 13.56MHz. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: FR-4. Components: RF detectors, control ICs. Connectors: BNC and card edge.
Structural Characteristics
Standard PCB form factor, status LEDs, RF connectors, card edge interface.
Working Principle
It measures forward and reflected RF power, calculates impedance mismatch, and drives stepper motors in the matching network to tune capacitance and inductance for minimum reflected power.
Installation Requirements
Install in RF control section. Connect forward/reflected power sensors. Connect matching network motor cables. Calibrate at commissioning.
Usage Notes
Calibrate matching periodically. Inspect RF connectors. Handle with ESD precautions.
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