Technical Specifications
Input channels: 8 optical detector inputs. Wavelength range: 200nm to 800nm. Sampling rate: 1kHz per channel. Resolution: 16-bit. Power supply: 24V DC. Power dissipation: 12W. Operating temperature: 15°C to +35°C.
Functional Features
Eight-channel optical signal input. High-speed data sampling. Built-in spectral analysis. Endpoint detection algorithm. Analog and digital output.
Application Scenarios
It provides endpoint detection for dielectric etch, conductor etch and plasma processing systems in Lam semiconductor manufacturing equipment.
Performance Parameters
Sampling rate: 1kHz per channel. Resolution: 16-bit. Wavelength range: 200-800nm. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: FR-4. Detectors: silicon photodiodes. Components: high-speed amplifiers and ADCs. Connectors: fiber optic and electrical connectors.
Structural Characteristics
Standard PCB form factor, status indicators, fiber input ports, card edge connector.
Working Principle
It receives optical emission signals from the process chamber via fiber optics, converts light intensity to electrical signals, digitizes and analyzes the spectral data to detect etch endpoint, and triggers process termination.
Installation Requirements
Install in designated analysis slot. Connect optical fibers from chamber viewport. Align wavelength calibration. Verify endpoint recipe.
Usage Notes
Clean fiber connectors periodically. Calibrate wavelength reference. Handle with ESD and optical precautions.
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