Technical Specifications
Slots: 16 card slots. Bus type: enhanced parallel system bus. Power rails: 5V DC, ±15V DC, 24V DC. Signal types: digital, analog, high-speed serial. Power capacity: 12A @ 5V, 6A @ 24V. Operating temperature: 15°C to +35°C.
Functional Features
Sixteen-slot capacity for system expansion. Multiple power rails for diverse module requirements. Improved signal integrity with termination networks. Compatible with Lam 2300 and 9600 platforms.
Application Scenarios
It serves as the upgraded backplane for Lam Research etch and deposition system control cabinets with expanded I/O configurations.
Performance Parameters
Bus speed: 16Mbps. Power capacity: 12A @ 5V DC. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: 2-layer heavy copper FR-4. Connectors: gold-plated card edge sockets. Power bars: solid copper.
Structural Characteristics
Chassis mount backplane, 16 card edge connectors, integrated power bus bars, mounting hardware.
Working Principle
It distributes multiple DC power rails and system communication signals to all installed modules, enabling data exchange and power delivery across the modular control system.
Installation Requirements
Secure to chassis with standoffs. Verify voltage rails before module installation. Install cards in designated slot positions.
Usage Notes
De-energize before servicing. Inspect connectors periodically. Follow ESD handling procedures.
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