Technical Specifications
Slots: 14 card slots. Bus type: parallel system bus. Power rails: 5V DC, 24V DC. Signal types: digital, analog, serial. Power capacity: 10A @ 5V, 5A @ 24V. Operating temperature: 15°C to +35°C.
Functional Features
Fourteen-slot backplane for modular I/O and control cards. Distributed power distribution to all slots. Standardized signal routing. On-board termination for signal integrity. Compatible with Lam 2300 series systems.
Application Scenarios
It serves as the main backplane for Lam 2300 series etch system control cabinets, housing control, I/O and interface modules.
Performance Parameters
Bus speed: 10Mbps. Power capacity: 10A @ 5V DC. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: heavy copper FR-4. Connectors: gold-plated card edge sockets. Power bars: copper bus bars.
Structural Characteristics
Chassis-mount backplane board, parallel card edge connectors, power bus bars, mounting standoffs.
Working Principle
It distributes system power and communication signals to all installed plug-in modules, enabling data exchange between modules and the main controller via the parallel system bus.
Installation Requirements
Mount in equipment chassis with standoffs. Secure mounting screws. Install modules in designated slots. Verify power rails before installing cards.
Usage Notes
Power off before installing or removing modules. Inspect connectors for bent pins. Clean contacts periodically. Follow ESD procedures.
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