Technical Specifications
Axes: 4 independent motion axes. Output type: pulse/direction. Maximum pulse rate: 200kHz. Input voltage: 24V DC. Feedback: incremental encoder input. Communication: system backplane. Power dissipation: 12W. Operating temperature: 15°C to +35°C.
Functional Features
Four-axis motion control for multi-degree-of-freedom wafer handlers. S-curve acceleration/deceleration profiling. Encoder position feedback. Home and limit switch inputs. On-board motion sequencing.
Application Scenarios
It controls wafer transfer robots, load lock mechanisms, wafer aligners and material handling subsystems in Lam etch and deposition systems.
Performance Parameters
Pulse rate: 200kHz maximum. Position resolution: 1 pulse. Update rate: 1ms per axis. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: FR-4 with conformal coating. Components: industrial-grade motion control ICs. Connectors: gold-plated connectors.
Structural Characteristics
Standard equipment PCB, front panel status LEDs, card edge interface, mounting hardware.
Working Principle
It receives motion commands from the system controller, generates profiled pulse and direction signals to drive motor drives, and monitors encoder feedback to verify position and speed for closed-loop motion control.
Installation Requirements
Install in designated motion control slot. Connect motor and encoder cables. Secure mounting hardware. Verify axis calibration.
Usage Notes
Follow ESD handling procedures. Calibrate home position periodically. Inspect connector pins for wear. Do not adjust parameters without authorization.
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