Technical Specifications
Power supply: 24V DC. Temperature inputs: 4 thermocouple channels. Control outputs: 4 heater drive outputs. Temperature range: 0°C to 1200°C. Accuracy: ±1°C. Communication: system backplane interface. Power dissipation: 10W. Operating temperature: 15°C to +35°C.
Functional Features
Four-channel temperature monitoring and control. Built-in cold junction compensation for thermocouples. PID temperature control algorithm. Over-temperature and sensor fault detection. Compatible with Lam 2300 etch platforms.
Application Scenarios
It provides temperature regulation for etch chambers, deposition stations, wafer heating modules and thermal processing subsystems in Lam semiconductor manufacturing equipment.
Performance Parameters
Temperature accuracy: ±1°C. Update rate: 200ms per channel. Control resolution: 12-bit. Operating temperature range: 15°C to +35°C.
Material Composition
PCB: FR-4 glass epoxy. Components: precision analog ICs, power semiconductors. Connectors: gold-plated pin headers.
Structural Characteristics
Standard PCB form factor, on-board status indicators, card edge connector, and chassis mounting points.
Working Principle
It measures chamber temperature via thermocouple inputs, compares the value to the setpoint, and executes a PID control algorithm to modulate heater power output, maintaining process temperature at the desired value.
Installation Requirements
Install in designated equipment chassis slot. Connect thermocouple and heater wiring. Secure card mounting screws. Verify system gr
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