Technical Specifications
Operating Environment: High vacuum, halogen corrosive plasma environment
Operating Temperature: 10℃ ~ 220℃
Mounting: Bolt fixed installation
Surface Treatment: Precision machining and passivation treatment
Cleanliness Standard: Semiconductor cleanroom grade
Functional FeaturesPrecision positioning and mechanical support for internal chamber assemblies.Low particle generation and low outgassing material property.Resist erosion from plasma and corrosive process gas.Stable dimensional performance under repeated thermal cycling.Auxiliary vacuum sealing for chamber assembly.Modular design for fast on-site maintenance and replacement.
Application ScenariosLam Research plasma etch vacuum chamber system.Semiconductor wafer fabrication plasma processing subsystem.Internal supporting and positioning mechanical structure of chamber.
Fab preventive maintenance spare parts for Lam etch platform.Wafer plasma etching production equipment.
Performance ParametersHelium leak rate: Meet high vacuum chamber leak specificationParticle emission: Minimal particle release during thermal cycleThermal deformation: Low dimensional variation under temperature fluctuationChemical resistance: Stable performance under halogen plasma environment
Material CompositionBase material: High purity aluminum alloySurface treatment: Hard anodized anti-corrosion coatingAuxiliary parts: High purity fluoropolymer sealing elements
Structural CharacteristicsMonolithic precision machined solid component.Pre-machined positioning pin holes and threaded mounting holes.Seal groove for vacuum sealing assembly.Stress relieved structure to reduce thermal distortion.Compact outline adapting to limited internal chamber space.
Working Principle
This component acts as supporting and positioning structure inside vacuum chamber. It maintains precise relative position of adjacent chamber assemblies under thermal and mechanical load, preserves vacuum sealing integrity and minimizes particle contamination during wafer processing.
Installation Requirements
Complete particle inspection and cleaning inside ISO cleanroom before installation.
Check precision surface for scratch, crack and contamination.
Align positioning features accurately during assembly.
tighten mounting bolts following factory specified torque sequence.
Carry out helium leak test after installation.
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