Technical Specifications Working Medium: Halogen and inert semiconductor process gas Operating Pressure: High vacuum environment Operating Temperature: 10℃ ~ 180℃ Mounting: Chamber side flange installation Material Cleanliness: Semiconductor cleanroom grade
Functional Features Integrated gas manifold for uniform gas distribution. Ultra-low leak sealing structure for vacuum chamber. Low particle and low outgassing material property. Resist plasma and corrosive process gas erosion. Modular structure for fast on-site replacement. Precision positioning interface matching chamber assembly.
Application Scenarios Lam plasma etch vacuum chamber gas supply assembly. Semiconductor wafer fabrication thin film etching process. Process gas distribution subsystem inside reaction chamber. Preventive maintenance spare module for Lam etcher platform. Advanced wafer manufacturing plasma processing equipment.
Performance Parameters Helium leak rate: Ultra low vacuum leak standard Particle emission: Meet fab cleanroom requirement Outgassing rate: Minimal gas release under vacuum Chemical resistance: Stable under halogen plasma environment
Material Composition Main manifold body: High purity stainless steel alloy Sealing components: High purity fluoropolymer seal Positioning bracket: Anodized high purity aluminum alloy
Structural Characteristics Pre-assembled compact integrated manifold structure. Electropolished internal gas flow channel. Standard flange interface for chamber connection. Built-in positioning pin for alignment during installation. Seal groove design for vacuum sealing assembly.
Working Principle This module transports process gas from upstream gas panel into wafer reaction chamber. It distributes gas evenly above wafer surface and maintains vacuum sealing of gas path. It prevents external contamination entering chamber and ensures consistent gas concentration for plasma etching reaction.
Installation Requirements Carry out disassembly and inspection inside ISO cleanroom. Check sealing surface and gas channel for particle and scratch. Align positioning pin and flange hole accurately during assembly. Tighten flange bolts according to specified torque sequence. Perform helium leak test and gas purge after installation.
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