Technical Specifications Board Type: VMEbus Processor Single Board Computer Bus Interface: VME back‑plane bus On‑board Resource: Embedded processor, memory module Power Supply: VME chassis back‑plane power supply Operating Temperature: 0 °C to +60 °C Storage Temperature: ‑40 °C to +85 °C Relative Humidity: 5%‑95%, non‑condensing Form Factor: Standard VME double‑height board Certifications: CE industrial automation hardware compliance
Functional Features Provides core computing capability for VME‑bus chassis control system. Supports embedded operating system and user control application running. Works as VME bus master to realize high‑speed access to peripheral VME boards. Carries debug interface for on‑site system maintenance and diagnosis.
Application Scenarios Mainly used in VME‑bus architecture industrial control equipment, industrial simulation platform and large‑scale process control system. As main control hardware for real‑time industrial computing occasions.
Performance Parameters Processing performance satisfies industrial embedded real‑time computing requirement. On‑board memory supports stable long‑term industrial application program operation. Data transmission efficiency complies with VME bus protocol standard.
Structural Characteristics Standard double‑height VME printed circuit board assembly. Gold‑plated edge connector for connecting VME chassis back‑plane. Front‑panel with status LED indicators and external debug ports. Screw locking mechanism for fastening inside chassis slot.
Working Principle After chassis power‑on, the board completes hardware self‑test and initialization. The embedded processor runs system software, accesses peripheral I/O and communication board cards via VME back‑plane bus, executes control logic algorithm, completes data processing and system control work.
Installation Requirements Cut off total power supply of VME chassis before board installation. Insert VMIVME7740‑841 into appropriate VME master slot and fasten front‑panel screws. Complete firmware configuration and application software deployment after power‑on.
Usage Notes Anti‑static protection must be taken during board handling and replacement. Hot‑plug under power‑on state is strictly prohibited. Ensure chassis internal ventilation to avoid over‑heating of processor board.
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