Technical Specifications Slot Quantity:7 module slots Backplane Bus:RX3i high‑speed parallel backplane bus Maximum Backplane Current:8A @5VDC Isolation Voltage:1500V RMS Operating Temperature:0℃～+60℃ Storage Temperature:-40℃～+85℃ Relative Humidity:5%‑95%, non‑condensing Certifications:CE, UL, cUL
Functional Features Standard 7‑slot expansion carrier, high‑speed backplane data transmission, mechanical locking structure for plug‑in modules, support expansion cable connection to main rack, compatible with full series RX3i modules.
Application Scenarios I/O point expansion for RX3i control system, decentralized cabinet layout, production line automation, process control skid‑mount equipment.
Performance Parameters Backplane bus transmission rate meets RX3i protocol specification Supports hot‑insertion of modules under power‑off status Single slot failure does not damage entire chassis backplane Shock & vibration:Comply with IEC 60068
Structural Characteristics Metal housing with industrial coating Internal integrated backplane bus circuit board Front‑open module installation opening Module mechanical locking latch for each slot Expansion cable interface on side panel DIN‑rail mounting holes and screw fixing holes
Working Principle Connect with RX3i main rack via dedicated expansion cable. Internal backplane bus establishes data and power path for each inserted module. Transmit I/O data and control signals between expansion rack and main CPU through expansion link. Each slot provides power supply and bus signal for corresponding plug‑in hardware.
Installation Requirements Mount chassis on standard DIN‑rail or fix with screw fasteners inside control cabinet. Complete reliable protective grounding for metal housing. Use official dedicated expansion cable to link main rack and expansion chassis. Calculate total power consumption of inserted modules and shall not exceed 8A backplane limit. Cut off system power before plugging or removing modules. Ensure cabinet ventilation and no condensation.
Usage Notes Do not mix non‑RX3i series modules into chassis. Avoid overloading total backplane current. Keep expansion cable away from high‑voltage power cables. Do not disassemble internal backplane circuit on site. Prevent dust accumulation, corrosive gas and liquid splash.
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