Technical Specifications
Working air pressure range: 0.3 MPa to 0.6 MPa
Operating voltage for solenoid valve: 24V DC
Operating temperature: 10°C to 40°C
Relative humidity: 20% to 80%, non-condensing
Air medium: dry filtered compressed air
Functional FeaturesIntegrated solenoid valve and pressure detection unit. Real-time air pressure monitoring and abnormal pressure alarm. Quick response for gas circuit switching. Dust-proof structure adapted to semiconductor clean room environment.
Application Scenarios
Semiconductor wafer handler end effector, vacuum chuck and pneumatic clamping unit in wafer fabrication cleanroom.
Performance Parameters
Switch response time: less than 20ms
Pressure detection precision: ±0.01MPa
Maximum air flow: 12 L/min
Working cycle life: more than 10 million cycles
Structural CharacteristicsCompact integrated manifold structure. Built-in air filter and pressure sensor. Quick plug air pipe connectors. Standard mounting holes for installation on robot arm.
Material CompositionMain manifold body: anodized aluminum alloy. Sealing ring: fluororubber. Connector: PEEK plastic and stainless steel.
Working PrincipleAfter receiving control signal, the solenoid valve switches the air path. Compressed air flows to the pneumatic actuator to realize clamping or releasing movement. The pressure sensor collects gas pressure data and feeds back to the main controller to judge clamping state.
Installation RequirementsInstall on wafer robot arm with fixing screws. Connect dry clean compressed air pipeline. Check air tightness after pipeline connection. Avoid pipeline bending and air leakage.
Usage NotesUse only filtered dry compressed air without oil mist. Regularly check sealing rings for aging. Release air pressure before disassembly. Prevent particle pollution in cleanroom.
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