Technical Specifications Main Processor Chip: 32‑bit MPC860 processor running at 50 MHz Flash Memory: 6 MB CRC‑protected flash for system firmware and user application storage DRAM Memory: 16 MB parity‑protected DRAM for program runtime execution and SOE event storage NVRAM Memory: 8 KB CRC‑protected non‑volatile memory for retention of process variables Backplane Bus: Tricon TriBus high‑speed redundant backplane bus Operating Temperature: 0 °C to +60 °C Storage Temperature: -40 °C to +85 °C Certifications: SIL3, IEC61508, ATEX, UL, FM Module Form: Full‑height single‑slot Tricon rack processor module Weight: 1.4 kg
Functional Features Triple‑modular redundant three‑leg processor architecture with hardware voting. Execute safety application logic downloaded from TriStation engineering software. Collect I/O module data and implement two‑out‑of‑three voting computation. Comprehensive system‑wide self‑diagnosis covering processor, memory, backplane bus and each I/O module. Sequence‑of‑events SOE event timestamp recording function. Support hot‑swap redundant processor online replacement without system shutdown. Front‑panel multi‑group LED indicators showing run, fault, maintenance status. Non‑volatile memory retains critical process variables after power loss.
Application Scenarios Core control unit for petrochemical plant SIS emergency shutdown system. Oil‑gas production and pipeline safety instrumented system main controller. Power‑plant turbine and boiler safety interlock control system. Refinery burner management system core logic processor. Chemical plant fire and gas safety protection system. High‑risk process industry safety‑critical control logic execution platform.
Performance Parameters System Scan Cycle: Deterministic configurable scan cycle for safety logic execution Voting Mode: Two‑out‑of‑three hardware voting among three processor branches SOE Timestamp Resolution: High‑precision millisecond‑level event time‑stamp recording Fault Tolerance: Single processor‑leg fault does not interrupt complete system safety‑logic operation Memory Protection: CRC and parity check detect memory data corruption
Material Composition Main circuit board: Industrial‑grade conformal coated printed circuit board. Mechanical frame: High‑strength reinforced alloy rack insertion frame. Connector components: Gold‑plated backplane golden finger for TriBus bus connection. Internal components: Industrial‑grade redundant processor chips, flash memory, DRAM, NVRAM, fault‑diagnosis logic circuits. Structural fasteners: Vibration‑resistant anti‑loosening metal screws.
Structural Characteristics Full‑height single‑slot plug‑in structure for Tricon standard rack processor slot. Front‑panel LED indicator array displaying running, fault and diagnostic status. Backplane golden finger interface connecting redundant TriBus backplane bus. Integrated internal shielding to restrain electromagnetic interference impact. Mechanical locking buckle for reliable module fixing in rack against vibration displacement.
Working Principle Three independent processor branches run identical safety application logic in parallel. All I/O module data is transmitted to three processor branches via TriBus backplane bus. Each branch completes logic computation independently. Hardware voting circuit compares output results from three branches and executes two‑out‑of‑three voting to generate final system control decision. Built‑in diagnostic circuit continuously checks processor operation status, memory integrity and backplane bus communication health. When single‑branch hardware fault appears, faulty branch is isolated, system continues running on remaining two branches and uploads fault alarm information. SOE events are timestamped and stored inside non‑volatile memory for subsequent event review.
Installation Requirements Install main processor module into dedicated processor slot of Tricon rack chassis. Complete reliable protective grounding for whole chassis according to official grounding specification. Confirm firmware version compatibility between processor module and each I/O module. User safety application logic shall be downloaded to module through TriStation configuration software before commissioning. Redundant processor hot‑swap replacement must strictly follow site safety operating procedure. Control cabinet ambient temperature and humidity must stay within rated range without condensation.
Usage Notes Firmware upgrade and application download shall only use official TriStation engineering software. Prohibit on‑site disassembly or component‑level repair of processor module; return defective unit to authorized maintenance center. Observe front‑panel LED indicators during daily system inspection. Do not cut off system power supply during firmware downloading and upgrading process. Back‑up user safety application program file and SOE event data periodically. Implement strict safety management during processor module replacement to avoid accidental safety‑logic bypass.
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