Technical Specifications
Terminal configuration is 36 IEC box-style screw-clamp terminals in A1-A18 and B1-B18 rows. Voltage rating is 0-264 VAC continuous with 300 VAC transient withstand. Wire size is single copper 0.2-2.5 mm² (24-14 AWG). Operating temperature range is 0°C to 60°C. Mounting is DIN rail or panel snap-on. Dimensions are approximately 66.8 mm length x 133.4 mm height x 70 mm width. Weight is approximately 0.13-0.2 kg for the carrier only.
Functional Features
Supports wiring for up to 32 I/O points plus 4 shared power/ground connections. Includes provisions for shielding and grounding to minimize EMI. Passive carrier requires no firmware or configuration.
Application Scenarios
Single-module I/O drops on conveyors, machine control stations, assembly lines, remote monitoring nodes, and distributed process control points.
Performance Parameters
Current rating is 2 A per point and 8 A total for power/ground terminals. Supports high-density wiring for 32-point modules. Backplane signal integrity is maintained for deterministic network operations.
Material Composition
Industrial-grade polymer housing with tin-plated copper terminals and zinc-plated steel mounting hardware.

Structural Characteristics
Compact box-style form factor compatible with all VersaMax digital and analog modules. Integrated backplane bus connector maintains power and data continuity.
Working Principle
The carrier serves as a passive interconnection component, providing the physical backplane bus interface for high-speed data transfer between field modules and the CPU. Mechanical coupling ensures consistent I/O density scaling across the rack.
Installation Requirements
Snap securely onto grounded DIN rail or panel. Connect field wiring to 36 terminals per manual pinout. Attach VersaMax I/O module by snapping onto the carrier. Provide grounding via the carrier’s ground bar or terminals.
Usage Precautions
Ensure all signals wired to the terminal block are properly segregated per site safety standards. Torque terminal connections to manufacturer specifications. Verify module recognition in the CPU or NIU during commissioning.













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