Technical Specifications Board Type: VMEbus Single Board Computer CPU Bus Interface: VME back‑plane bus On‑board Resource: Processor, memory, on‑board storage Power Supply: VME chassis back‑plane power supply Operating Temperature: 0 °C to +60 °C Storage Temperature: ‑40 °C to +85 °C Relative Humidity: 5%‑95%, non‑condensing Form Factor: Standard VME double‑height board Certifications: CE industrial single‑board computer compliance
Functional Features Works as main control CPU unit of VME‑bus industrial chassis. Runs embedded operating system and user control application program. Realizes high‑speed data access and communication with all other VME board cards via back‑plane. Equipped with external expansion interfaces for system debugging and data interaction.
Application Scenarios Serves as main control core for large‑scale VME‑bus industrial real‑time control system, industrial simulation equipment and special automatic control platform. Cooperates with I/O and communication boards to complete integrated control functions.
Structural Characteristics Standard double‑height VME printed circuit board assembly. Gold‑plated VME back‑plane edge connector. Front‑panel carries external physical interfaces and status indicator LEDs. Front‑panel screw locking structure for chassis slot fixing.
Working Principle After chassis power‑on, on‑board CPU initializes hardware resources, loads embedded system software. It accesses memory and storage resources on board, and reads / writes data to each peripheral VME board card through VME back‑plane bus to complete system control logic calculation and data processing.
Installation Requirements Completely cut off VME chassis power supply before installing CPU board. Insert VMIVME‑7698‑345 into master‑capable VME slot, lock front‑panel screws. Complete system firmware and embedded software configuration after power‑on startup.
Usage Notes Strictly execute anti‑static operation during handling board card. Do not perform hot‑plug action when chassis is powered. Guarantee sufficient ventilation and heat dissipation space inside VME chassis.
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