Technical Specifications
Supply voltage: 24V DC
Operating temperature: 10°C to 40°C
Humidity: 20%~80% non-condensing
Input channel: 8 channels digital signa
Signal level: 5V TTL
Functional Features
Multi-channel optical signal acquisition and signal conditioning. Real-time cassette position state output. Filter circuit to eliminate light interference in clean room. Open circuit and short circuit diagnosis for sensor circuit.
Application Scenarios
Semiconductor wafer load port, FOUP cassette positioning station, wafer input and output module of lithography equipment.
Performance Parameters
Signal sampling cycle: less than 0.5ms
Detection resolution: 0.1mm
Insulation resistance: ≥1000MΩ
MTBF: more than 50000 hours
Structural Characteristics
Multi-layer PCB board with conformal coating. Gold-plated pin connectors. Reserved fixed holes for chassis installation. Onboard signal indicator LEDs.
Material Composition
PCB substrate: FR-4 flame retardant glass fiber board. Connector pins: gold-plated copper alloy. Electronic components: silicon chip and ceramic capacitor.
Working Principle
The board receives optical sensor switching signals, processes and filters signals, then transmits cassette position and wafer status to the main controller. It outputs fault alarm when sensor line breaks or short circuit occurs.
Installation Requirements
Install vertically inside load port cabinet. Lock the board with standard screws. Complete all sensor wiring before power supply. Keep away from strong light source.
Usage Notes
Power off before plugging or unplugging connectors. Prevent dust contamination on PCB surface. Avoid strong light directly irradiating optical sensors. Check indicator status regularly during routine maintenance.
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