Technical Specifications
Rated voltage: 24V DC
Rated speed: 3000 rpm
Rated torque: 0.45 N·m
Operating temperature: 10°C to 40°C
Storage temperature: -20°C to 60°C
Protection grade: IP30
Application Scenarios
8-inch and 12-inch semiconductor wafer transfer robots, wafer cassette load port equipment, substrate handling robotic arms.
Performance Parameters
Positioning repeatability: ±0.001 mm
Encoder resolution: 2000 ppr
Maximum allowable radial load: 15N
Service life under rated working condition: more than 20000 hours
Structural Characteristics
Integrated structure combining servo motor and incremental encoder. Output shaft adopts stainless steel material. Standard flange mounting structure. Internal sealed bearing set reduces particle generation.
Material Composition
Motor housing: aluminum alloy. Rotor and stator: silicon steel sheet and copper winding. Output shaft: stainless steel. Bearing: high precision ceramic ball bearing.
Working Principle
It receives pulse motion commands from the control board, converts electric energy into mechanical rotary motion. The built-in encoder feeds back real-time shaft angle and speed signal to the controller to form closed-loop control, so as to realize accurate position control of wafer transfer arm.
Installation Requirements
Mount through flange surface with torque controlled screws. Align the output shaft with transmission mechanism precisely. Keep the motor in horizontal installation status. Reserve clearance for heat dissipation.
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