Technical Specifications
Number of outputs: 32, organized in 2 isolated groups of 16. On-state voltage drop: 0.5V DC maximum. Flexbus current: 80mA @ 5V DC. Power dissipation: 5.3W maximum. Isolation: 50V continuous between groups. Operating temperature range: 0°C to +55°C. Storage temperature range: -40°C to +85°C.
Functional Features
Thirty-two high-density outputs maximize I/O count per module. Electronic per-channel protection prevents damage from overloads and short circuits. Two isolated output groups support separate voltage references. Hot-swap capability allows replacement without system shutdown. Status indicators show output state and fault conditions.

Application Scenarios
It is ideal for high-density discrete output control, solenoid banks, indicator light panels, small motor control, distributed I/O systems, OEM machinery, and assembly line control stations.
Material Composition
Housing is UL 94 V-0 rated flame-retardant plastic. Output circuits use solid-state semiconductor devices. PCB is FR-4 glass fiber substrate.
Structural Characteristics
It features compact Flex I/O form factor with plastic housing, front panel status LEDs, two isolated output groups, and rear Flex bus connector for terminal base mounting.
Working Principle
It receives control commands from the host controller via the Flex bus, drives solid-state output circuits to switch 24V DC power to field loads, and monitors output current for overload and short-circuit conditions, triggering automatic shutdown on fault conditions.
Installation Requirements
Mount on 1794-TB32 or compatible terminal base units. Use 22-14 AWG copper wire rated at 90°C. Observe group isolation boundaries when wiring different voltage sources. Ensure adequate heat dissipation for high-current applications.












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