Xycom XVME-100

Technical Specifications
    • Memory Capacity
      • RAM: 1 MB maximum
      • EPROM: 1 MB maximum
      • Mask programmable ROM: 1 MB maximum
      • EEPROM: 256 KB maximum
    • Device Support
      • EPROM/RAM/ROM: 8 K×8 to 128 K×8 devices
      • EEPROM: 8 K×8 to 32 K×8 devices with quick-write capability
Tag:
  • Speed Grades: 100 ns, 150 ns, 200 ns, 250 ns
  • Power Requirements
    • +5 V DC: 900 mA typical, 1 A maximum
    • Battery: 1.4 A·h, 6-year life typical
  • Battery Backup: On-board circuit maintains RAM contents during power failure
  • VMEbus Interface
    • Compliant with VMEbus specification C.1
    • A24:D16/D08(EO) DTB slave
    • 4 bus-grant lines and IACK daisy-chained
  • Form Factor: 3U single-height VME board
  • Environmental Ratings
    • Operating temperature: 0 °C to 65 °C
    • Non-operating temperature: –40 °C to 85 °C
    • Humidity: 5 % to 95 % RH non-condensing
    • Shock: 30 g operating, 50 g non-operating
    • Vibration: 2.5 g operating, 5.0 g non-operating
Functional Features
  • Dual Memory Banks: Two banks of four sockets allow mixed memory types and sizes
  • Jumper Selectable Configuration: Address, memory size, speed, and pinout set via jumpers
  • Power-Down Protection: Write-prohibited below 4.75 V to prevent data corruption
  • SYSRESET Option: Asserts VMEbus SYSRESET for system-level reset control
  • Front-Panel Kit: Optional 6 U front-panel kit for user I/O indicators
Application Scenarios
  • Industrial Automation: Real-time data buffering for PLC and DCS systems in harsh factory environments
  • Defense and Aerospace: Mission computers, avionics test benches, and radar data storage
  • Transportation: On-board train control and trackside signaling systems requiring reliable memory retention
  • Energy Management: Substation SCADA and renewable-energy inverters needing persistent event logging




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