Xycom 3870-00165

Technical Specifications

Part Number: 3870-00165
Controller Type: EPROM-based micro-controller (EPROM version M11)
Power Supply: 24 VDC ±10 %, 2.5 A max
I/O Channels
- 8 × 24 V opto-isolated digital inputs
- 8 × 24 V/0.5 A open-collector digital outputs
- 2 × 0–10 V analog inputs (position feedback)
- 2 × 0–10 V analog outputs (motor speed or pneumatic pressure)
  - Communication Ports
    - RS-232 for firmware download and diagnostics
    - TTL-level parallel bus for real-time host commands
  - Memory: 32 kB EPROM firmware, 2 kB SRAM runtime variables
  - Operating Temperature: 0 °C to +60 °C
  - Storage Temperature: –20 °C to +85 °C
  - Relative Humidity: 5 % to 95 % non-condensing
  - Shock & Vibration: 10 g half-sine 11 ms shock, 0.5 g swept sine 5–500 Hz vibration
  - Dimensions: 165 mm × 110 mm × 35 mm DIN-rail mount
  - Weight: 0.4 kg
  Functional Highlights
  - High-Speed Position Loop Closed-loop PID algorithms update every 1 ms to maintain ±0.1 mm repeatability on linear actuators and ±0.05° on rotary stages.
  - Vacuum-Compatible Design Conformal-coated PCB and low-outgassing components ensure reliable operation inside load-lock and transfer chambers.
  - Interlock & Safety Logic Programmable interlocks monitor vacuum pressure, door sensors, and EMO signals to prevent wafer damage or equipment collision.
  - Field-Upgradeable Firmware EPROM-based firmware can be reflashed via RS-232 to support new valve profiles or process recipes without hardware replacement.
  - LED Status Array Front-panel LEDs display power, fault, valve-open, valve-closed, and communication status for rapid troubleshooting.
  - DIN-Rail Mounting Compact footprint and snap-on DIN-rail clip simplify installation inside crowded electrical panels.
  Applications
  - Semiconductor Wafer Fab Slit-valve control for cluster-tool transfer modules, gate-valve actuation in PVD/CVD systems, and robotic arm positioning in EFEM units.
  - Flat-Panel Display Manufacturing Glass-substrate load-lock isolation and robotic handler coordination in OLED and LCD production lines.
  - Solar Cell Production Vacuum isolation valves and linear actuators in thin-film deposition and etch tools.
  - Research & Development High-vacuum chamber automation in university and national-lab thin-film research systems.

Tag：

Communication Ports
- RS-232 for firmware download and diagnostics
- TTL-level parallel bus for real-time host commands
Memory: 32 kB EPROM firmware, 2 kB SRAM runtime variables
Operating Temperature: 0 °C to +60 °C
Storage Temperature: –20 °C to +85 °C
Relative Humidity: 5 % to 95 % non-condensing
Shock & Vibration: 10 g half-sine 11 ms shock, 0.5 g swept sine 5–500 Hz vibration
Dimensions: 165 mm × 110 mm × 35 mm DIN-rail mount
Weight: 0.4 kg

Functional Highlights

High-Speed Position Loop
Closed-loop PID algorithms update every 1 ms to maintain ±0.1 mm repeatability on linear actuators and ±0.05° on rotary stages.
Vacuum-Compatible Design
Conformal-coated PCB and low-outgassing components ensure reliable operation inside load-lock and transfer chambers.
Interlock & Safety Logic
Programmable interlocks monitor vacuum pressure, door sensors, and EMO signals to prevent wafer damage or equipment collision.
Field-Upgradeable Firmware
EPROM-based firmware can be reflashed via RS-232 to support new valve profiles or process recipes without hardware replacement.
LED Status Array
Front-panel LEDs display power, fault, valve-open, valve-closed, and communication status for rapid troubleshooting.
DIN-Rail Mounting
Compact footprint and snap-on DIN-rail clip simplify installation inside crowded electrical panels.

Applications

Semiconductor Wafer Fab
Slit-valve control for cluster-tool transfer modules, gate-valve actuation in PVD/CVD systems, and robotic arm positioning in EFEM units.
Flat-Panel Display Manufacturing
Glass-substrate load-lock isolation and robotic handler coordination in OLED and LCD production lines.
Solar Cell Production
Vacuum isolation valves and linear actuators in thin-film deposition and etch tools.
Research & Development
High-vacuum chamber automation in university and national-lab thin-film research systems.

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