MOTOROLA TPMC 917-10

• Storage Interface:
  • CompactFlash (CF) socket for solid-state storage
  • Optional IDE interface for additional storage expansion
• Graphics Controller: Integrated 2D/3D graphics processor with support for analog and digital displays
• Video Output:
  • VGA (analog RGB)
  • LVDS (Low-Voltage Differential Signaling) for flat panel displays
• Network Connectivity:
  • Dual 10/100/1000BASE-T Ethernet ports (Gigabit Ethernet)
  • Supports full-duplex operation and jumbo frames
• I/O Interfaces:
  • Four USB 2.0 ports
  • Two RS-232/422/485 serial ports
  • Parallel port (optional)
  • PS/2 interface for keyboard and mouse
  • Audio I/O (line-in, line-out, microphone)
• Expansion Support:
  • PMC site for additional I/O or processing modules
  • PCI bus master support for high-speed data transfer
• Power Requirements:
  • +5 VDC nominal
  • Typical power consumption: 8–12 W (depending on load and configuration)
• Operating Temperature:
  • Commercial: 0°C to +55°C
  • Extended: -40°C to +85°C (ruggedized version)
• Storage Temperature: -55°C to +100°C
• Humidity: 5% to 95% relative humidity, non-condensing
• Vibration and Shock Resistance: Designed to meet MIL-STD-810 and EN 61373 standards for rail applications

Functional Features

• Rugged Design: Conformal coating, wide-temperature components, and robust PCB layout for operation in harsh environments
• Long Lifecycle Support: Designed for extended product availability, ideal for systems requiring decades of service
• High Reliability: ECC memory support, watchdog timer, and hardware monitoring for system health
• BIOS and Firmware:
  • Flash-upgradable BIOS
  • Support for legacy boot options and PXE network boot
  • Configuration via jumper settings or software tools
• Real-Time Performance: Optimized for deterministic operation in real-time operating systems (RTOS)
• Security Features:
  • Hardware write protection for CF storage
  • BIOS password protection
  • Trusted Platform Module (TPM) support (on select variants)

Mechanical and Environmental Compliance

• Cooling: Conduction-cooled or air-cooled variants available
• Mounting: Standard 0.8-inch or 0.6-inch PMC spacing; compatible with IEEE P1386.1
• EMI/EMC: Compliant with FCC Part 15, CE, and industrial EMC standards
• Safety Standards: Meets UL, CSA, and TÜV requirements

Software Support

• Operating Systems:
  • Windows XP Embedded, Windows 7 Embedded
  • Linux (Red Hat, SUSE, Debian, and real-time variants)
  • VxWorks, Integrity, QNX, and other RTOS platforms
• Drivers and SDKs: Available from TEWS for integration with host systems

Applications

• Defense and Aerospace: Avionics systems, mission computers, radar processing, and electronic warfare
• Industrial Automation: Programmable logic controllers (PLCs), human-machine interfaces (HMIs), and process monitoring
• Transportation: Railway signaling, onboard train control, and traffic management systems
• Medical Equipment: Imaging systems and diagnostic devices requiring long-term reliability
• Energy and Utilities: Substation automation, SCADA systems, and power grid monitoring
• Test and Measurement: Embedded data acquisition and signal processing platforms

Manufacturer and Support
The TPMC917-10 is manufactured by TEWS Technologies GmbH, headquartered in Germany. It is distributed globally through industrial automation and embedded systems suppliers. TEWS provides long-term availability, engineering support, customization services, and firmware updates. The module is designed for integration into CPCI, VME, and custom carrier boards, offering a scalable solution for embedded computing needs in mission-critical environments.