Technical Specifications
Mechanical & Environmental
Dimensions: H 133 mm × W 69 mm × D 118 mm
Weight: 0.37 kg
Operating Temperature: −40 °C to +70 °C (ambient)
Storage Temperature: −40 °C to +85 °C
Relative Humidity: 10 % – 95 % non-condensing
Shock: 15 g peak, 11 ms half-sine
Vibration: 2 g, 10 Hz – 500 Hz
Dimensions: H 133 mm × W 69 mm × D 118 mm
Weight: 0.37 kg
Operating Temperature: −40 °C to +70 °C (ambient)
Storage Temperature: −40 °C to +85 °C
Relative Humidity: 10 % – 95 % non-condensing
Shock: 15 g peak, 11 ms half-sine
Vibration: 2 g, 10 Hz – 500 Hz
Power Requirements
Backplane Current Draw: 5 V @ 0.5 A, 3.3 V @ 0.2 A
Power Dissipation: 3.5 W max
Backplane Current Draw: 5 V @ 0.5 A, 3.3 V @ 0.2 A
Power Dissipation: 3.5 W max
Processor & Memory
CPU: 32-bit ARM9, 200 MHz
User Memory: 10 MB flash for user data
Local Logic Memory: 20 KB (supports all languages except C)
CPU: 32-bit ARM9, 200 MHz
User Memory: 10 MB flash for user data
Local Logic Memory: 20 KB (supports all languages except C)
Real-Time Clock
Battery-backed, ±1 minute per month drift
Battery-backed, ±1 minute per month drift
Communication Interfaces
Ethernet Port: 1 × 10/100 Mbps RJ-45, auto-negotiate, auto-MDIX
Serial Ports:
Ethernet Port: 1 × 10/100 Mbps RJ-45, auto-negotiate, auto-MDIX
Serial Ports:
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COM1: RS-232, RJ-45
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COM2: RS-485, 5-pin terminal block
Communication Protocols
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TCP/IP, UDP/IP
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SRTP (GE proprietary)
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Ethernet Global Data (EGD)
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Modbus TCP (server & client)
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Modbus RTU (master/slave) via serial
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SNP, Serial I/O
Diagnostics & Management
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Built-in web server
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Station status LEDs (RUN, FORCE, FAULT, LINK, ACT, 10/100)
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Comprehensive diagnostic log
Functional Highlights
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Remote Access: Configure, monitor, and control I/O modules from any node on the Ethernet network.
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Legacy Integration: Transparently links PACSystems RX3i CPUs to Series 90-30 I/O.
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Flexible Topology: Supports star, line, or ring topologies; easily integrates into existing infrastructures.
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Redundancy Support: Operates seamlessly with redundant controllers for critical applications.
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In-System Firmware Upgrade: Firmware can be updated via Ethernet without removing the module.
Application Scenarios
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Distributed I/O Systems: Remote placement of I/O racks along production lines, eliminating long cable runs.
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Process Control: Oil refining, chemical, and pharmaceutical plants requiring precise remote monitoring.
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Power Generation & Distribution: Substation automation, turbine control, and load management.
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Manufacturing: Automotive assembly, material handling, and packaging machines.
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Building Automation: HVAC, lighting, and access control systems.
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Water & Wastewater: Remote pump stations and treatment facilities.














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